Driven by the ever-increasing market demands in computing, communication, and multimedia applications, the microelectronics industry has got rapid development recently. Because of the innovations and advances at almost every technological level, such as material, process, equipment, device, circuit and system, silicon-based logic and memory IC technologies continue to be the industry’s R&D focus with the addition of nano-scaled scaling. This gives a strong boost to the traditional “Moore’s Law”, which keeps on increasing the function density while reducing the cost per function in an IC, and bring the R&D activities to a new level known as “More Moore”. At the same time, a new trend in microelectronic industry, namely “More than Moore”, has expanded the scope of IC applications by integrating non-digital functionalities into traditional CMOS micro-systems, thus enabling the deployment of innovative product solutions required by modern information world.

This special is devoted to cover the advances in state-of-the-art development, grand challenges, innovative solutions, and broad scope of microelectronic technologies related to both “More Moore” and “More than Moore”. Papers are solicited in, but not limited to the following main topics：

1. Silicon/Germanium/III-V IC devices

2. Advanced process technologies

3. Advanced and emerging memories

4. SOC/SIP design and integration

5. Analog/RF/power integrated circuits

6. Device and interconnect reliability

7. Modeling and simulation

8. Semiconductor materials and material characterization

9. Sensors, MEMS and NEMS

 

Prospective authors should prepare their manuscripts in accordance with the format requirement for Science China Information Sciences and submit the PDF version of the completed manuscripts online according to the instructions given at http://info.SciChina.com.

 

Important Dates:

 

 

 

Guest Editor

Ru Huang <ruhuang@pku.edu.cn>, Peking University, China

Bin Zhao <bin.zhao@freescale.com>, Freescale Semiconductor, USA